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Substrate Repair Kits

Medium Round Pads are available standard sizes ranging from 150um to 350um. Pads have an optional 100um tail for contacting to an existing trace. Custom geometries and configurations are available

Pads in the image are 125um NiPdAu plated pads with 1/2 oz Cu base.

Pads can be packaged in vials or gel pack and come with and without an assembly kit.
Medium Round Pads (MRP)
Similar to Medium Round Pads, Medium Square Pads are available in standard sizes ranging from 150um to 350um. Pads have an optional tail for contacting to an existing trace. Custom geometries and extentions are available.

Pads in the image are 150um square pads with 350um long and 50um wide lead. PdAu plating compliments the 1 oz Cu base pads.

Pads can be packaged in vials or gel pack and come with and without an assembly kit.
Medium Square Pads (MQP)
Substrates, modules, and BGA (including uBGA and interposers) require smaller geometries than PCB features. Geometries in the mid range are better in this application for successful rebuilds. Pads in the 175um to 350um range and traces in the 50um to 75um range. Pads and traces are available in various finished and custom geometries. 
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